Special Issue on Advances in Materials Science of IC Interconnects and Packaging
| Author | : Frank G. Shi |
| Publisher | : |
| Total Pages | : 160 |
| Release | : 2001 |
| ISBN-10 | : OCLC:248256303 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Special Issue on Advances in Materials Science of IC Interconnects and Packaging by : Frank G. Shi
Download or read book Special Issue on Advances in Materials Science of IC Interconnects and Packaging written by Frank G. Shi and published by . This book was released on 2001 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
