Silicon Wafer Bonding Technology

Silicon Wafer Bonding Technology
Author :
Publisher : Univ. Press of Mississippi
Total Pages : 180
Release :
ISBN-10 : 0852960395
ISBN-13 : 9780852960394
Rating : 4/5 (394 Downloads)

Book Synopsis Silicon Wafer Bonding Technology by : Subramanian S. Iyer

Download or read book Silicon Wafer Bonding Technology written by Subramanian S. Iyer and published by Univ. Press of Mississippi. This book was released on 2002 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in detail, and subsequent chapters cover bonding by mechanical removal, the Smart Cut method of hydrogen exfoliation, the ELTRAN thinning technique and hydrogen annealing, engineering methods of wafer characterization, and quality assurance for bonded wafers. A chapter on advanced applications looks at applications in optoelectronics, very large scale integration (VLSI), microelectromechanical systems (MEMS), and photonics. A glossary is included, plus a table comparing various bonding methods. The editors work in the private sector. Annotation copyrighted by Book News, Inc., Portland, OR


Silicon Wafer Bonding Technology Related Books

Silicon Wafer Bonding Technology
Language: en
Pages: 180
Authors: Subramanian S. Iyer
Categories: Science
Type: BOOK - Published: 2002 - Publisher: Univ. Press of Mississippi

DOWNLOAD EBOOK

This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in
Wafer Bonding
Language: en
Pages: 524
Authors: Marin Alexe
Categories: Science
Type: BOOK - Published: 2004-05-14 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the mos
Handbook of Wafer Bonding
Language: en
Pages: 435
Authors: Peter Ramm
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-13 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a
3D and Circuit Integration of MEMS
Language: en
Pages: 521
Authors: Masayoshi Esashi
Categories: Technology & Engineering
Type: BOOK - Published: 2021-03-16 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system
Wafer Level 3-D ICs Process Technology
Language: en
Pages: 365
Authors: Chuan Seng Tan
Categories: Technology & Engineering
Type: BOOK - Published: 2009-06-29 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa