Mitigating Tin Whisker Risks

Mitigating Tin Whisker Risks
Author :
Publisher : John Wiley & Sons
Total Pages : 270
Release :
ISBN-10 : 9780470907238
ISBN-13 : 0470907231
Rating : 4/5 (231 Downloads)

Book Synopsis Mitigating Tin Whisker Risks by : Takahiko Kato

Download or read book Mitigating Tin Whisker Risks written by Takahiko Kato and published by John Wiley & Sons. This book was released on 2016-05-23 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.


Mitigating Tin Whisker Risks Related Books

Mitigating Tin Whisker Risks
Language: en
Pages: 270
Authors: Takahiko Kato
Categories: Technology & Engineering
Type: BOOK - Published: 2016-05-23 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whiske
Mitigating Tin Whisker Risks
Language: en
Pages: 272
Authors: Takahiko Kato
Categories: Technology & Engineering
Type: BOOK - Published: 2016-04-28 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whiske
Lead-Free Electronics
Language: en
Pages: 472
Authors: Edwin Bradley
Categories: Technology & Engineering
Type: BOOK - Published: 2007-10-26 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary refer
Lead-Free Electronic Solders
Language: en
Pages: 370
Authors: KV Subramanian
Categories: Technology & Engineering
Type: BOOK - Published: 2007-06-28 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in elect
Lead-free Soldering Process Development and Reliability
Language: en
Pages: 515
Authors: Jasbir Bath
Categories: Technology & Engineering
Type: BOOK - Published: 2020-06-12 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topic