Advances In 3d Integrated Circuits And Systems

Advances In 3d Integrated Circuits And Systems
Author :
Publisher : World Scientific
Total Pages : 392
Release :
ISBN-10 : 9789814699037
ISBN-13 : 9814699039
Rating : 4/5 (039 Downloads)

Book Synopsis Advances In 3d Integrated Circuits And Systems by : Hao Yu

Download or read book Advances In 3d Integrated Circuits And Systems written by Hao Yu and published by World Scientific. This book was released on 2015-08-28 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.


Advances In 3d Integrated Circuits And Systems Related Books

Advances In 3d Integrated Circuits And Systems
Language: en
Pages: 392
Authors: Hao Yu
Categories: Technology & Engineering
Type: BOOK - Published: 2015-08-28 - Publisher: World Scientific

DOWNLOAD EBOOK

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
3D Integration for VLSI Systems
Language: en
Pages: 376
Authors: Chuan Seng Tan
Categories: Science
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press

DOWNLOAD EBOOK

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
Wafer Level 3-D ICs Process Technology
Language: en
Pages: 365
Authors: Chuan Seng Tan
Categories: Technology & Engineering
Type: BOOK - Published: 2009-06-29 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa
3D IC Devices, Technologies, and Manufacturing
Language: en
Pages: 220
Authors: Hong Xiao
Categories: Three-dimensional integrated circuits
Type: BOOK - Published: 2016-04 - Publisher: Spie Society of Photo-Optical Instrumentation Engineers (Spie

DOWNLOAD EBOOK

This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS
Handbook of 3D Integration, Volume 1
Language: en
Pages: 798
Authors: Philip Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r