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Language: en
Pages: 129
Pages: 129
Type: BOOK - Published: 2008-03-23 - Publisher: Springer Science & Business Media
The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitig
Language: en
Pages: 519
Pages: 519
Type: BOOK - Published: 2018-01-09 - Publisher: CRC Press
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and
Language: en
Pages: 195
Pages: 195
Type: BOOK - Published: 2018-03-14 - Publisher: Springer
This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection o
Language: en
Pages: 632
Pages: 632
Type: BOOK - Published: 2012-04-17 - Publisher: John Wiley & Sons
The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wi
Language: en
Pages: 106
Pages: 106
Type: BOOK - Published: 2011-09-23 - Publisher: Springer Science & Business Media
This book will introduce design methodologies, known as Built-in-Self-Test (BiST) and Built-in-Self-Calibration (BiSC), which enhance the robustness of radio fr