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Strain Analysis in Silicon Power Devices for the Advancement of Active Thermal-mechanical Control Techniques
Language: en
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Strain Analysis in Silicon Power Devices for the Advancement of Active Thermal-mechanical Control Techniques

Authors: Matthew L. Spencer
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Type: BOOK - Published: 2007 - Publisher:

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Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors
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Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors

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Strain Effect in Semiconductors
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Strain Effect in Semiconductors

Authors: Yongke Sun
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Strain Effect in Semiconductors: Theory and Device Applications presents the fundamentals and applications of strain in semiconductors and semiconductor devices
Scientific and Technical Aerospace Reports
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Scientific and Technical Aerospace Reports

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Applied mechanics reviews
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Applied mechanics reviews

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