Special Issue: Emerging Interconnect and Packaging Technologies

Special Issue: Emerging Interconnect and Packaging Technologies
Author :
Publisher :
Total Pages : 170
Release :
ISBN-10 : OCLC:552149700
ISBN-13 :
Rating : 4/5 ( Downloads)
DOWNLOAD EBOOK
Book Synopsis Special Issue: Emerging Interconnect and Packaging Technologies by : Fu Guo

Download or read book Special Issue: Emerging Interconnect and Packaging Technologies written by Fu Guo and published by . This book was released on 2009 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Special Issue: Emerging Interconnect and Packaging Technologies Related Books

Special Issue: Emerging Interconnect and Packaging Technologies
Language: en
Pages: 170

Special Issue: Emerging Interconnect and Packaging Technologies

Authors: Fu Guo
Categories:
Type: BOOK - Published: 2009 - Publisher:

DOWNLOAD EBOOK

Special Issue: Pb-free Solders and Emerging Interconnect and Packaging Technologies
Language: en
Pages: 178

Special Issue: Pb-free Solders and Emerging Interconnect and Packaging Technologies

Authors: Kwang-Lung Han
Categories:
Type: BOOK - Published: 2010 - Publisher:

DOWNLOAD EBOOK

Advanced Interconnect and Packaging
Language: en
Pages: 0

Advanced Interconnect and Packaging

Authors: Wensheng Zhao
Categories: Technology & Engineering
Type: BOOK - Published: 2023-02-20 - Publisher: Mdpi AG

DOWNLOAD EBOOK

Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performan
Special Issue on Packaging and Soldering Technologies for Electronic Interconnects
Language: en
Pages: 188

Special Issue on Packaging and Soldering Technologies for Electronic Interconnects

Authors: Gautam Ghosh
Categories: Microelectronic packaging
Type: BOOK - Published: 2000 - Publisher:

DOWNLOAD EBOOK

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
Language: en
Pages: 873

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Authors: Mohd Arif Anuar Mohd Salleh
Categories: Science
Type: BOOK - Published: 2023-07-02 - Publisher: Springer Nature

DOWNLOAD EBOOK

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, M