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SiP System-in-Package Design and Simulation
Language: en
Pages: 508
Authors: Suny Li (Li Yang)
Categories: Technology & Engineering
Type: BOOK - Published: 2017-07-24 - Publisher: John Wiley & Sons

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An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design
MicroSystem Based on SiP Technology
Language: en
Pages: 867
Authors: Suny Li
Categories: Technology & Engineering
Type: BOOK - Published: 2022-05-28 - Publisher: Springer Nature

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This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total
Modeling and Simulation for Microelectronic Packaging Assembly
Language: en
Pages: 586
Authors: Shen Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2011-05-17 - Publisher: John Wiley & Sons

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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba
Power Electronic Packaging
Language: en
Pages: 606
Authors: Yong Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe
System-in-Package
Language: en
Pages: 93
Authors: Lei He
Categories: Computers
Type: BOOK - Published: 2011-06-20 - Publisher: Now Publishers Inc

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Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the s