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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers
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Type: BOOK - Published: 2017-03-09 - Publisher: Springer
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packagi
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Type: BOOK - Published: 2019-03-26 - Publisher: Springer
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between
Language: en
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Type: BOOK - Published: - Publisher: Springer Nature
Language: en
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Pages: 269
Type: BOOK - Published: 2012-06-21 - Publisher: Cambridge University Press
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This
