Related Books
Language: en
Pages: 586
Pages: 586
Type: BOOK - Published: 2011-08-24 - Publisher: John Wiley & Sons
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba
Language: en
Pages: 576
Pages: 576
Type: BOOK - Published: 2011 - Publisher:
Language: en
Pages: 0
Pages: 0
Type: BOOK - Published: 2021 - Publisher:
Language: en
Pages: 662
Pages: 662
Type: BOOK - Published: 1997-01-31 - Publisher: Springer Science & Business Media
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design method
Language: en
Pages: 436
Pages: 436
Type: BOOK - Published: 2019-11-14 - Publisher: Woodhead Publishing
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysi