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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design method
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Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to pro
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Type: BOOK - Published: 2002 - Publisher: McGraw Hill Professional
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (C
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