Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronic and Photonic Packaging, RF Microwave, Telecommunications, Education, Packaging Technologies, Keynote Lecture
Author | : American Society of Mechanical Engineers Electronic and Photonic Packaging Division |
Publisher | : |
Total Pages | : 518 |
Release | : 2001 |
ISBN-10 | : OCLC:248301055 |
ISBN-13 | : |
Rating | : 4/5 ( Downloads) |
Book Synopsis Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronic and Photonic Packaging, RF Microwave, Telecommunications, Education, Packaging Technologies, Keynote Lecture by : American Society of Mechanical Engineers Electronic and Photonic Packaging Division
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