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Direct Copper Interconnection for Advanced Semiconductor Technology
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Direct Copper Interconnection for Advanced Semiconductor Technology

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In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semicond
Nanopackaging
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Nanopackaging

Authors: James E. Morris
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This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire