Faithin Omaha eBook Collection

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologi

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and mate

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, rel

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces