Faithin Omaha eBook Collection

Download or read book Department of Defense Advisory Group on Electron Devices. Special Technology Area Review on Microwave Packaging Technology. Appendix written by and published by . This book was released on 1993 with total page 144 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic packaging is identified as an area providing opportunity for system performance enhancement for both defense and commercial applications. The move to microwave/millimeter wave multi-chip assemblies with high density interconnects is causing a significant shift in the current practices of how packages are being designed and manufactured. The longer term trend is to move to subsystem or multi-level packaging schemes to achieve higher levels of system integration. Packaging costs are being emphasized early in system developments. Workshop goals include the following: (1) Define packaging and interconnect technology and manufacturing problems/issues; (2) Recommend solutions to these problems by developing an investment strategy that can be used by government and industry; and (3) Build upon and couple to the 2-4 Mar 92 aged electronics packaging technology star.