Area Array Packaging Processes

Area Array Packaging Processes
Author :
Publisher : McGraw Hill Professional
Total Pages : 276
Release :
ISBN-10 : 0071428291
ISBN-13 : 9780071428293
Rating : 4/5 (293 Downloads)
DOWNLOAD EBOOK
Book Synopsis Area Array Packaging Processes by : Ken Gilleo

Download or read book Area Array Packaging Processes written by Ken Gilleo and published by McGraw Hill Professional. This book was released on 2004 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.


Area Array Packaging Processes Related Books

Area Array Packaging Processes
Language: en
Pages: 276

Area Array Packaging Processes

Authors: Ken Gilleo
Categories: Technology & Engineering
Type: BOOK - Published: 2004 - Publisher: McGraw Hill Professional

DOWNLOAD EBOOK

This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach
Area Array Interconnection Handbook
Language: en
Pages: 1250

Area Array Interconnection Handbook

Authors: Karl J. Puttlitz
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third
Area Array Packaging Handbook
Language: en
Pages: 832

Area Array Packaging Handbook

Authors: Ken Gilleo
Categories: Business & Economics
Type: BOOK - Published: 2002 - Publisher: McGraw Hill Professional

DOWNLOAD EBOOK

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (C
Area Array Package Design
Language: en
Pages: 224

Area Array Package Design

Authors: Ken Gilleo
Categories: Technology & Engineering
Type: BOOK - Published: 2004 - Publisher: McGraw Hill Professional

DOWNLOAD EBOOK

This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Area Array Packaging Materials
Language: en
Pages: 182

Area Array Packaging Materials

Authors: Ken Gilleo
Categories: Ball grid array technology
Type: BOOK - Published: 2004 - Publisher: McGraw Hill Professional

DOWNLOAD EBOOK

This engineering reference covers the most important assembly processes in modern electronic packaging.