Proceedings

Proceedings
Author :
Publisher :
Total Pages : 404
Release :
ISBN-10 : UOM:39015048297330
ISBN-13 :
Rating : 4/5 ( Downloads)
DOWNLOAD EBOOK
Book Synopsis Proceedings by :

Download or read book Proceedings written by and published by . This book was released on 2001 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Proceedings Related Books

Proceedings
Language: en
Pages: 404

Proceedings

Authors:
Categories: Integrated circuits
Type: BOOK - Published: 2001 - Publisher:

DOWNLOAD EBOOK

Proceedings of the ... International Conference on Microelectronics
Language: en
Pages: 290

Proceedings of the ... International Conference on Microelectronics

Authors:
Categories: Microelectronics
Type: BOOK - Published: 2001 - Publisher:

DOWNLOAD EBOOK

Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices
Language: en
Pages: 332

Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices

Authors: Electrochemical Society. Meeting
Categories: Technology & Engineering
Type: BOOK - Published: 2004 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK

Nanopackaging
Language: en
Pages: 553

Nanopackaging

Authors: James E. Morris
Categories: Technology & Engineering
Type: BOOK - Published: 2008-12-30 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Language: en
Pages: 1471

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Authors: Ephraim Suhir
Categories: Technology & Engineering
Type: BOOK - Published: 2007-05-26 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-