Related Books
Language: en
Pages: 242
Pages: 242
Type: BOOK - Published: 2018-05-28 - Publisher: Woodhead Publishing
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integr
Language: en
Pages: 420
Pages: 420
Type: BOOK - Published: 2018-10-17 - Publisher: Woodhead Publishing
Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior
Language: en
Pages: 154
Pages: 154
Type: BOOK - Published: 2018-09-12 - Publisher: BoD – Books on Demand
SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, D
Language: en
Pages: 526
Pages: 526
Type: BOOK - Published: 2003 - Publisher: World Scientific
Presents state-of-the-art GaN and SiC electronic devices, as well as detailed applications of these devices to power conditioning, r. f. base station infrastruc
Language: en
Pages: 359
Pages: 359
Type: BOOK - Published: 2021-12-09 - Publisher: IET
Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and elec