Faithin Omaha eBook Collection

This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, M

Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Ha

This document records the activities and presents the findings of the Electronic Packaging and Interconnect Technology Working Group part of the IDA/OSD Reliabi